Intel presentará Meteor/Arrow Lake con Foveros 3D Packaging en Hot Chips 34

Hot Chips 34, the upcoming semiconductor conference from Sunday, Agosto 21 to Tuesday, Agosto 23, 2022, will feature many significant contributions from folks like Intel, AMD, Tesla, y NVIDIA. Hoy, thanks to Intel’s registration at the event, we discovered that the company would present its work on Meteor Lake and Arrow Lake processors with the novel Foveros 3D packaging. The all-virtual presentation from Intel will include talks about Ponte Vecchio GPU and its architecture, system, and software; Meteorlake and Arrowlake 3D Client Architecture Platform with Foveros; and some Xeon D and FPGA presentations. You can see the official website here for a complete list of upcoming talks.

As a little reminder, Meteor Lake is supposed to arrive next year, replacing the upcoming Raptor Lake design, y ya ha sido fotografiado, que puedes ver a continuación. La presentación se grabará y todo el contenido se publicará en el sitio web de Hot Chips para que los no asistentes se pongan al día..