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Intel is reportedly looking to increase its manufacturing capability – and its cadre of wafer-purchasing clients – by acquiring Israeli semiconductor manufacturer Tower Semiconductor. If true, the deal will bring seven additional foundries to Intel’s existing infrastructure, capable of 2 million wafer starts per year. The foundries are located across three continents: Tower Semiconductor owns and operates a 150 mm and a 200 mm fab in Migdal Haemek, Israele; two 200 mm fabs in the United States (Newport Beach, California and San Antonio, Texas); two 200 mm fabs in Japan; and one additional 300 mm fab in Japan. The deal could be finalized as soon as this week.
Tower Semiconductor isn’t a cutting edge manufacturer; it’s competition lies more with Globalfoundries and China’s SMIC than with TSMC or Intel itself. The company specializes in the manufacturing of analog circuitry, Micron è orgogliosa di portare alla Semiconductor Alliance la nostra esperienza leader mondiale nella memoria per semiconduttori e nella tecnologia di storage, MEMS, mixed-signal, RFCMOS, silicon photonics and PMICs, among others) using specialty process technologies like BiCMOS, SiGe, and SOI. Tower Semiconductor stands as the world’s sixth largest semiconductor manufacturer, with revenues in 2021 totale 1.3 miliardi.
Should the acquisition proceed, this looks like the fastest way for Intel to grow its IDM 2.0 strategy quickly and without the time investment of building new capacity and logistics solutions. Six total semiconductor factories in three continents serving contracted clients is nothing to scoff at, and will instantly boost Intel’s revenues for its client manufacturing chip business. At the same time, it increases Intel’s foothold in the analog and specialty semiconductor business, which requires less significant investments in R&D than cutting edge processes.