TEAMGROUP Announces Several New Product Lines: DDR5, AIO CLCs, Portable SSDs, and More
In recent years, TEAMGROUP has been focusing on developing diverse cooling solutions and applying unique materials to the SSD of the Gaming product line, T-FORCE. Inspired by the four natural elements of wind, fire, water, and earth, TEAMGROUP has utilized four exclusive components of cooling to T-FORCE gaming products. The wind element can be found in TEAMGROUP’s CARDEA A440 Pro M.2 PCIe SSD as further improvements are made on existing aluminium fin thermal conductivity technology for fluid ventilation and more effective cooling performance. The impressive read/write speeds of the CARDEA A440 Pro are also approaching the defined maximum speeds for Gen4 x4 by PCI-SIG at an outstanding 7,400/7,000 MB/s.
The fire element is integrated into the aerospace-grade ceramic heat sink used by T-FORCE CARDEA Ceramic C440 M.2 PCIe SSD. Produced from burning furnaces, the ceramic heat sink features tiny pores and a lightweight body, setting it apart from the aluminium ones. Moreover, the ceramic material can prevent from the interference of electromagnetic waves, and the incredibly high thermal design power (TDP) rating making it more resistant to retaining heat. CARDEA Ceramic C440 SSD has read/write speeds of 5,000/4,400 MB/s and is available in the capacity of 1 TB and 2 TB.
Since the launching of the world’s first liquid cooling M.2 SSD, CARDEA Liquid M.2 PCIe SSD, TEAMGROUP has continued to make breakthroughs in R&D in respond to the rapid developments of PCIe interfaces and rising read/write speeds. As such, close-looped water cooling systems are replaced with a looped liquid cooling one, and the exclusive all-in-one integrated water cooling system was developed, which will be revealed at the online event tonight. Make sure to tune in for the first glimpse of the latest water cooling technology.
TEAMGROUP has long looked to the thinness and lightness of graphene, and has utilized its strong thermal conductivity and excellent cooling properties. Graphene has therefore become an essential element in TEAMGROUP’s storage products, like foundations built on earth. The advent of T-FORCE CARDEA ZERO Z440 was widely discussed and its graphene/copper heat sink, measured less than 1 mm in thickness, effectively eliminates interference during installation. With invention patents from the U.S. and Taiwan, the graphene/copper heat sink is indeed one of TEAMGROUP’s most iconic technologies. TEAMGROUP was the first to introduce white graphene heat sink last month, which is applied to the T-FORCE CARDEA A440 Pro Special Series M.2 PCIe SSD. The SSD for PS5 storage expansion is expected to be available in October 2021 and gamers are urged to take advantage of the incredible SSD when it hits the shelves.
Having identified the market needs of professional and HEDT (High-end Desktop) users, TEAMGROUP launched the top-spec 8X32GB kit for the popular T-FORCE XTREEM ARGB MEMORY in Q2 of 2021. The chip chosen underwent rigorous internal testing and is proven compatible with the TRX40 motherboards and ensured stable with dual-/quad-channel memories. Users no longer need to worry about compatibility issues and can enjoy a smooth multitasking experience with the T-FORCE XTREEM ARGB MEMORY. The memory is equipped with the industry’s first full mirror reflection design and is undoubtedly the first choice for high-end gaming PC builders.
In an age where pictures and videos permeate our lives, demands for storage space have also grown exponentially. TEAMGROUP has, therefore, developed a diverse range of storage products. Tonight, at the online launch event, T-FORCE M200 EXTERNAL SSD, using a USB3.2 Gen2x2 (20 Gbps) Type-C interface and can reach read/write speeds of up to 2,000 MB/s, is making its debut. Test results from the T-FORCE Lab show that the M200 EXTERNAL SSD can transfer a single 10 GB file within 20 seconds, and with up to 8 TB in storage available, users can store up to 180 games or 4,000 hours of high-def videos. Inspired by military designs, the M200 EXTERNAL SSD is also equipped with TEAMGROUP’s patented graphene cooling technology, ensuring superior transfer speeds while keeping things exceptionally cool. While the SSD will be unveiled tonight, the product is expected to officially launch in Q4.
Pioneering the DDR5 Era: Integrating OC and RGB Technologies
With the arrival of the DDR5 era, TEAGRMOUP became the first to release the TEAMGROUP ELITE DDR5 MEMORY module at COMPUTEX 2021. It continues to collaborate with major motherboard manufacturers, such as ASUS, ASRock, BIOSTAR, GIGABYTE, MSI[1], to test the overclocking capabilities. At the online event today, views will experience the integration of overclocking and RGB technologies through the revolutionary DDR5 products, so stay tuned for the powerfulness of those incredible new lineups.
The T-FORCE VULCAN DDR5 GAMING MEMORY launched at the online event tonight is equipped with aluminium alloy for heat dissipation and ultra-conductive cooling gel that removes heat rapidly from the top down for more efficient cooling. The DDR5 memories have a reduced voltage loss and noise against the DDR4, and the VULCAN DDR5 GAMING MEMORY is a dual-channel DDR5 that offers 2X32G with frequency reaching as high as 5,200 MHz. It also supports the latest Intel XMP 3.0 and one-click overclocking technology with on-die ECC to autocorrect errors in DRAM units for better performance and stable computing.
TEAMGROUP remains a pioneer in the industry by launching the first DDR5 memory with RGB lighting, T-FORCE DELTA RGB DDR5 GAMING MEMORY, where each RGB LED lights equipped can be programmed individually for color and speed. DELTA RGB DDR5 GAMING MEMORY offers 5200 MHz single-channel memory kits in 16 GB or 32 GB and dual-channel memory kits in 2X16GB or 2X32GB. It supports the latest Intel XMP 3.0, one-click overclocking technology, and ECC functions, and has also been sent to major motherboard manufacturers such as ASUS, ASRock, BIOSTAR, Gigabyte, MSI, etc., for compatibility testing with various lighting control software. This new, exciting product will be available for purchase in Q4 of 2021.
With the core value of “Chill the Heat, Feel the Speed, Make it Big”, TEAMGROUP Online Launch Event 2021 offers three major solutions: Cooling, Large Capacity, and DDR5 to provide the best solutions for office workers, gamers, and creators with cutting-edge products and strengthened R&D capabilities. In addition to the product reveal, TEAMGROUP will be giving away prizes worth up to $7,000 USD to lucky viewers worldwide. Please visit the official event page at the scheduled time to witness TEAMGROUP unfolding the next glorious chapter of DDR5.