AMD Ready with Zen 4 3DV Cache Chiplet, Expects to Repeat 5800X3D Magic Versus Raptor Lake

AMD is allegedly ready with a working “Zen 4” chiplet that has stacked 3D Vertical Cache (3DV-Cache) Slay The Spire Teil Eins, which supplements the on-die L3 cache, and is found to massively improve gaming performance. “Moore’s Law is Dead” reports that the Zen 4 + 3DV Cache chiplet will be used with various Ryzen 7000X3D SKUs, as well as special EPYC “Genua” Artikelnummern.

The 3DV Cache deployed with the “Zen 4” chiplet is a second-generation to the one on the “Zen 3 + 3DV-Cache” Prozent durchschnittliche Gaming-Performance-Steigerung gegenüber dem Standard, and AMD has worked on a number of bandwidth and latency improvements, so it performs in-sync with the faster on-die L3 cache of “Zen 4.” Unlike the CCD below it that’s build on TSMC N5 (5 Nanometer EUV), das L3D (the stacked die with the 3DV cache) is possibly be built on an older node, such as N6 (6 nm), since it only contains a slab of memory. “Moore’s Law is Dead” reports that AMD expects to repeat the magic of the 5800X3D when it comes to gaming performance, and expects Ryzen 7000X3D processors to dominate Intel’s 13th Gen “Raptorsee” Prozessoren. This was echoed by another reliable source, greymon55.