DFI Empowers Edge AI Deployment with EC70A-TGU Compact Fanless System
Maintaining the small size of the previous generation fanless embedded system, the EC70A-TGU is equipped with a compact fanless design, measuring only 181.6 mm x 57 mm x 118.4 mm, while providing significantly upgraded performance. Außerdem, EC70A-TGU supports multiple I/Os, outperforming its counterparts with up to 6 USB 3.1 Häfen, and can be connected to more sensors and devices.
The EC70A-TGU also supports a wide temperature range of -20°C to 60°C and fanless design without performance compromising, meeting the harsh operating environment for factory automation and smart city applications. The system also includes onboard memory with vibration resistance to reduce the impact caused by movement.
DFI utilized the advantages of our advanced R&D-Design, continuing to optimize applications for developing a dedicated embedded system. The EC70A-TGU will help to accelerate the overall production efficiency, improve accuracy and achieve a zero-error production line, scaling up the performance of smart factories and intelligent warehouse applications.
Erleben Sie die Barrierefreiheit:
Intel 11th Generation Tiger Lake Core i7/i5/i3 processors
8 GB onboard memory and 1 SO-DIMM DDR4
Kompatibilität 4 LAN or 6 USB (by SKU)
Triple displays: 2 HDMI (4K@30 Hz) + 1 VGA (2K@60Hz)
Supports wide temperature operation: -20°C~60°C
Support M.2 B key 3042/3052 5G-NR module
Kompatibilität 15 years of product lifecycle
Focus Applications:
Factory automation
Mobile Robotics (AMR) / Automated Guided Vehicles (AGV)
Machine Vision
Medical Imaging