GIGABYTE Releases AORUS DDR5 5200MHz 32GB Memory Kit

[ad_1]

GIGABYTE TECHNOLOGIE Co. Ltd, ein führender Hersteller von Motherboards, Grafikkarten, and hardware solutions today announced AORUS DDR5 5200 MHz 32 GB Memory Kit to support the latest Intel Z690 platform for the brand new level performance. AORUS Memory DDR5 32 GB 5200 MHz features two 16 GB DDR5 XMP 5200 MHz design to provide higher frequency and performance than native DDR5 memories. With GIGABYTE Z690 motherboards, it can further unlock the limitation of memory clock to enhance performance by DDR5 XMP Booster and XMP 3.0 Benutzerprofil. The new On-Die ECC feature of DDR5 highlights error correction which can detect and correct most common memory data damage to improve the stability of data. Außerdem, the copper-aluminium heatspreader with the nano-carbon coating can effectively reduce the heat generated by the memories under high-speed operation, offering excellent performance and avoiding instability from overheating.

AORUS DDR5 5200 MHz 32 GB Memory Kit features two 16 GB DDR5 XMP 5200 MHz dual-channel design, and just fit the support of DDR5 memory on Intel Z690 platform. The brand new memory architecture features high memory clock speed, Energieeffizient, which enable DDR5 XMP Booster function on AORUS DDR5 5200 MHz 32 GB Memory Kit with GIGABYTE Z690 AORUS motherboards. “DDR5 XMP-Booster” can detect the brand of memory IC in the BIOS setting to allow users chose quickly from multiple built-in and pre-tuned memory overclocking profiles, boosting the native DDR or XMP DDR memory speed. Furthermore, “XMP 3.0 Benutzerprofil” enable users to create and store XMP profile on their own to unleash the extreme performance of memories.

AORUS DDR5 5200 MHz 32 GB Memory Kit equips robust thermal solutions of the copper-aluminium heatspreader with nano-carbon coating and high conductivity-thermal pad, damit Benutzer sicher sein können, dass ihr Speicher übertaktet wird. Die vom Leistungssteuerungs-IC und Speicherchip erzeugte Wärme kann schnell durch das Wärmeleitpad und den Kupferboden abgeführt werden, then the heat exchanges through the air between nano-carbon coated copper-aluminium heatspreader. The groove cut by CNC on the spreader enlarge the heat dissipation area to fasten the heat blown away by the system fans and drop the temperature. Users have no more worry about overclocking failures caused by overheating from high-speed memory operation or overvoltage. As for data security, AORUS DDR5 5200 MHz 32 GB Memory Kit supportOn-Die ECCerror correction function, which can detect and correct most common memory data damage for a more stable system operation compared to DDR4 to reduce unnecessary troubles.

Um eine überlegene Stabilität zu bieten, und ultimative Leistung des Gedächtnisses, AORUS DDR5 5200 MHz 32 Das GB-Speicherkit wurde mit ultrabeständigen GIGABYTE-Elementen implementiert und mit allen GIGABYTE-Motherboards verifiziert. AORUS DDR5 5200 MHz 32 GB Memory Kit has been shipped and will be soon available in the market.

For more details, please visit the official GIGABYTE website.

[ad_2]