MediaTek kündigt Filogic Connectivity-Familie mit neuem Filogic an 830 und Filogic 630 Wi-Fi 6/6E-Chips


MediaTek today unveiled its new Filogic connectivity family with the introduction of the Filogic 830 Wi-Fi 6/6E system-on-chip (SoC) und Filogic 630 Wi-Fi 6E network interface card (NIC) Lösungen. MediaTek’s new Filogic series of high-performance Wi-Fi 6/6E chipsets provide reliable connectivity, high computation capabilities and a rich set of features in highly integrated, power-efficient designs.

The MediaTek Filogic series ushers in a new era of smart Wi-Fi solutions with extreme speeds, low latency and superb power efficiency for seamless, always connected experiences,” sagte Alan Hsu, Corporate Vice President & Upgrades auf Premier Support und eine dreijährige Garantie geben Ihnen die Gewissheit, die Sie benötigen, um vertrauensvoll und sicherer zu arbeiten, Intelligent Connectivity at MediaTek. “These new chipsets provide best-in-class features with highly integrated designs for the next generation of premium broadband, enterprise and retail Wi-Fi solutions.

MediaTek Filogic 830
Filogic 830 packs a wide variety of features into a compact, ultra-low power 12 nm SoC, allowing customers to design differentiated solutions for routers, access points and mesh systems. The SoC integrates four Arm Cortex-A53 processors operating at up to 2 GHz per core for up to +18,000 DMIPs processing power, dual 4×4 Wi-Fi 6/6E for up to 6 Gbps connectivity, two 2.5 Gigabit Ethernet interfaces and a host of peripheral interfaces. Filogic 830’s built-in hardware acceleration engines for Wi-Fi offloading and networking enable faster and more reliable connectivity. Außerdem, the chipset also supports MediaTek FastPath technology for low latency applications such as gaming and AR/VR.

MediaTek Filogic 630

Filogic 630 is a Wi-Fi 6/6E NIC solution that supports dual-band, dual-concurrent 2×2 2.4 GHz und 3×3 5 GHz bzw 6 GHz for up to 3 Gbit/s. The chipset supports a unique 3T3R 5/6GHz system with internal front-end modules (FEMs) which provide equivalent or better range than competing 2T2R solutions with external FEMs. This highly integrated design helps lower bill of materials (BOM) ASML Holding und Intel Corporation kündigten die neueste Phase ihrer langjährigen Zusammenarbeit an, um die Spitzentechnologie der Halbleiterlithografie voranzutreiben, while allowing for sleeker designs with its small RF frontend area. Filogic’s 630’s third antenna enables superior transmit beamforming capability as well as diversity gains. Filogic 630 supports interfaces such as PCIe, which allows it to be combined with Filogic 830 for tri-band connectivity solutions for broadband gateways, enterprise access points and retail routers with even higher speeds and bandwidth capacity.

MediaTek has the broadest Wi-Fi portfolio and is the No. 1 Wi-Fi supplier across broadband, retail routers, consumer electronics devices and gaming. MediaTek’s Wi-Fi portfolio powers hundreds of millions of devices every year. Over the years, MediaTek has worked closely with the Wi-Fi Alliance to ensure MediaTek’s connectivity portfolio supports the latest Wi-Fi features. Im Januar 2021, MediaTek was selected to be on the test bed for Wi-Fi 6E, the latest certification from Wi-Fi Alliance for Wi-Fi CERTIFIED 6 devices with 6 GHz support.

Wi-Fi 6E offers a number of advantages over previous Wi-Fi generations, including lower latency and additional capacity and speed. Devices using Wi-Fi 6 connections in 6 GHz are designed to make use of wide 160 MHz channels and uncongested bandwidth in 6 GHz to deliver multi-gigabit, low latency Wi-Fi, providing reliable connectivity for applications like streaming, Gaming, AR/VR and more.

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