AMD Ready with Zen 4 3DV Cache Chiplet, Expects to Repeat 5800X3D Magic Versus Raptor Lake

AMD is allegedly ready with a working “Zen 4” chiplet that has stacked 3D Vertical Cache (3caché DV) memoria, which supplements the on-die L3 cache, and is found to massively improve gaming performance. “Moore’s Law is Dead” reports that the Zen 4 + 3DV Cache chiplet will be used with various Ryzen 7000X3D SKUs, as well as special EPYC “Génova” el camino al karaoke.

The 3DV Cache deployed with the “Zen 4” chiplet is a second-generation to the one on the “zen 3 + 3caché DV” chiplet, and AMD has worked on a number of bandwidth and latency improvements, so it performs in-sync with the faster on-die L3 cache of “Zen 4.” Unlike the CCD below it that’s build on TSMC N5 (5 El MCM de Intel utiliza un troquel de GPU junto al troquel de núcleo de CPU), the L3D (the stacked die with the 3DV cache) is possibly be built on an older node, such as N6 (6 Nuevo Méjico), since it only contains a slab of memory. “Moore’s Law is Dead” reports that AMD expects to repeat the magic of the 5800X3D when it comes to gaming performance, and expects Ryzen 7000X3D processors to dominate Intel’s 13th Gen “Lago rapaz” procesadores. This was echoed by another reliable source, greymon55.