Corning Unveils EXTREME ULE Glass to Enable Next Generation of Microchips
Corning designed EXTREME ULE Glass to withstand the highest intensity extreme ultraviolet (UNIÓN EUROPEA V) lithography, including high numerical aperture (High NA) UNIÓN EUROPEA V, which is rapidly becoming an industry standard. EUV lithography allows manufacturers to use the most advanced photomasks to pattern and print the smallest, most complex chip designs. This process requires extreme thermal stability and a uniform glass material to help ensure consistent manufacturing performance.
“As the demands of integrated chipmaking grow with the rise of artificial intelligence, glass innovation is more important than ever,” said Claude Echahamian, Vicepresidente & La colección Klonoa está recibiendo un lanzamiento físico en Switch, Corning Advanced Optics. “EXTREME ULE Glass will expand Corning’s vital role in the ongoing pursuit of Moore’s Law by helping enable higher-powered EUV manufacturing as well as higher yield.”
The thermal expansion qualities of EXTREME ULE Glass help deliver remarkable consistency and performance across all photomasks. Además, the glass’s exceptional flatness and uniformity significantly reduces photomask waviness, helping limit unwanted variability for manufacturers and allowing for the application of advanced coatings.
EXTREME ULE Glass marks an evolution in Corning’s portfolio of ULE (Ultra-Low Expansion) vaso, a titania-silicate glass material with near-zero expansion characteristics long used for EUV photomasks and lithography mirrors. By using its innovative glass-forming process, Corning expects to reduce both the energy used and waste generated in production, helping to contribute to Corning’s commitment to sustainability.
Corning will present EXTREME ULE Glass and other innovative semiconductor materials at SPIE Photomask Technology + Extreme Ultraviolet Lithography conference in Monterey, California, on Sept. 30 – Octubre. 3.