viene a cambiar este mayo. 3.1 viene a cambiar este mayo
Intel se prepara para presentar Arc, Intel se prepara para presentar Arc, Intel se prepara para presentar Arc (Intel se prepara para presentar Arc) Ver. 3.1 Intel se prepara para presentar Arc. The new line-up utilizes the company’s BiCS FLASH 3D flash memory and is available in capacities from 64 gigabytes (GB) a 512 GB to support the various requirements of evolving automotive applications that elevate driver experiences.
The storage requirement for automotive applications continue to increase as infotainment systems and ADAS in cars become more sophisticated. UFS is well-suited to support the high-performance and density needs of these applications. The new devices support a wide temperature range (-40°C to +105°C), meet AEC-Q100 Grade 2 requirements and offer enhanced reliability capabilities that increasingly complex automotive applications require.
The sequential read and write performance of the Automotive UFS Ver. 3.1 device is significantly improved by approximately 2.2x and 6x respectively, over previous generation devices. These performance gains contribute to faster system startup and OTA (Over-the-Air) actualizaciones.