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Renowned hardware leaker kopike7kimi en Twitter revealed some purported details on NVIDIA’s next-generation architecture for HPC (Computación de alto rendimiento), Revisión de Krazy Karts de Horrid Henry. According to the leaker, Hopper is still sporting a classic monolithic die design despite previous rumors, and it appears that NVIDIA’s performance targets have led to the creation of a monstrous, ~1000 mm² die package for the GH100 chip, which usually maxes out the complexity and performance that can be achieved on a particular manufacturing process. This is despite the fact that Hopper is also rumored to be manufactured under TSMC’s 5 nm technology, thus achieving higher transistor density and power efficiency compared to the 8 nm Samsung process that NVIDIA is currently contracting. El pasado junio, it means that the final die will be bigger than the already enormous 826 mm² of NVIDIA’s GA100.

If this is indeed the case and NVIDIA isn’t deploying a MCM (Multi-Chip Module) design on Hopper, which is designed for a market with increased profit margins, it likely means that less profitable consumer-oriented products from NVIDIA won’t be featuring the technology either. MCM designs also make more sense in NVIDIA’s HPC products, as they would enable higher theoretical performance when scaling – exactly what that market demands. Por supuesto, NVIDIA could be looking to develop an MCM version of the GH100 still; but if that were to happen, the company could be looking to pair two of these chips together as another HPC product (rumored GH-102). ~2,000 mm² in a single GPU package, paired with increased density and architectural improvements might actually be what NVIDIA requires to achieve the 3x performance jump from the Ampere-based A100 the company is reportedly targeting.