L'accélérateur de calcul AMD MI300 comprendrait huit matrices logiques

L'accélérateur de calcul MI300 de nouvelle génération d'AMD devrait augmenter considérablement la densité logique, selon une rumeur de Moore’s Law is Dead. Basé sur l'architecture de calcul CDNA3, the MI300 will be a monstrous large multi-chip module with as many as 8 logic dies (compute dies), each with its dedicated HBM3 stack. The compute dies (logic dies), will be 3D-stacked on top of I/O dies that pack the memory controllers, and the interconnect that performs the inter-die, and inter-package communication.

The report even goes on to mention that the compute die at the top level of the stack will be built on TSMC N5 (5 nm) silicon fabrication process, while the I/O die below will be TSMC N6 (6 nm). At this point it’s not known if AMD will use the package to wire the logic stacks to the memory stacks, or whether it will take the pricier route of using a silicon interposer, but the report supports the interposer theory—that an all-encompassing interposer seats all eight compute dies, all four I/O dies (each with two compute dies), and the eight HBM3 stacks. An interposer is a silicon die that facilitates high density microscopic wiring between two dies on a package, which are otherwise not possible through large package substrate wiring.