AMD RDNA3 offre plus de 50% Perf/Watt Uplift Semblable à RDNA2 vs. RDNA; RDNA4 annoncé
To begin with, RDNA3 debuts on the TSMC N5 (5 nm) nœud de fabrication de silicium, and will debut a chiplet-based approach that’s somewhat analogous to what AMD did with its 2nd Gen EPYC “Rome” and 3rd Gen Ryzen “Matisse” processeurs. Chiplets packed with the GPU’s main number-crunching and 3D rendering machinery will make up chiplets, while the I/O components, such as memory controllers, display controllers, media engines, etc., will sit on a separate die. Scaling up the logic dies will result in a higher segment ASIC.
AMD also stated that it has re-architected the compute unit with RDNA3 to increase its IPC. The graphics pipeline is bound to get certain major changes, trop. The company is doubling down on its Infinity Cache on-die cache memory technology, with RDNA3 featuring the next-generation Infinity Cache (which probably operates at higher bandwidths).
De l'apparence de celui-ci, RDNA3 will be exclusively based on 5 nm, and the company announced, pour la toute première fois, the new RDNA4 graphics architecture. It shared no details about RDNA4, except that it will be based on a more advanced node than 5 nm.
AMD RDNA3 is expected to debut in the second half of 2022, with ramp across 2023. RDNA4 is slated for some time in 2024.