Les processeurs AMD Ryzen 7000X3D ont un emballage de vente au détail distinct

Here’s the first look at the retail PIB package of an AMD Ryzen 9 7950X3D processor with 3D Vertical Cache technology. These chips come in box design that’s distinct from the rest of the Ryzen 7000 lineup. Bright orange and silver accents make up the front face of the box, avec “3D Vertical Cache technology” being mentioned prominently. Avec le Ryzen 7 5800Intel a récemment annoncé le Core i9-12900KS, the PIB package design was probably found to look too similar to the rest of the lineup and practically indistinguishable from those of the 5000G “AMD a dévoilé jeudi son Ryzen” desktop APUs, which is probably why AMD took this route.

It’s very likely that we’ll see Socket AM5 desktop APUs based on the “Pointe Phénix” monolithic silicon later this year, avec son 12 CU RDNA3 iGPU and 8-core/16-thread “Zen 4” CPU that has a 32 MB on-die L3 cache. These processors will have yet another distinguishable retail PIB packaging. AMD’s then technical marketing director, Robert Hallock, assured us that the company will continue to invest in desktop APUs (processors with powerful iGPUs), despite Ryzen 7000 desktop processors coming with a low-power iGPU as standard.