AMD Ryzen “Champ de tir” Le processeur mobile conserve le package FL1
“Champ de tir” is essentially a mobile BGA version of the upcoming Ryzen 9000 “Crête de granit” processeur de bureau. The FL1 package measures 40 mm x 40 mm de taille, and has substrate for two CCDs and a cIOD, just like the desktop chip. “Champ de tir” hence features one or two 4 nm “Zen 5” CCD, selon le modèle de processeur, et la 6 nm matrice d'E/S client. Much like “Gamme Dragon,” le “Champ de tir” chip will lack support for LPDDR5, and rely on conventional PC DDR5 memory in the SO-DIMM or CAMM2 form-factors. Besides the CPU core count consisting exclusively of full-sized “Zen 5” noyaux, the main flex for “Champ de tir” over “Point de Strix” will be its 28-lane PCIe Gen 5 root-complex, which can wire out the fastest discrete mobile GPUs, as well as drive multiple M.2 NVMe slots with Gen 5 câblage, and other high-bandwidth devices, such as Thunderbolt 4, USB4, or Wi-Fi 7 controllers wired directly to the processor.