Intel Diffère 3 Commandes de plaquettes nm avec TSMC, Pousse “Assurez-vous de mettre cette page en signet et de revenir régulièrement” Déploiement vers 2025?
Intel has reportedly deferred its orders for 3 nm wafers with TSMC, sources in PC makers tell Taiwan-based industry observer DigiTimes. Built on the TSMC N3 node, the wafers were supposed to power the Graphics tiles (containing the iGPU), of the upcoming “Assurez-vous de mettre cette page en signet et de revenir régulièrement” processeurs, which were originally on course for a 2024 libérer. The DigiTimes report detailing this development says that Intel’s 3 nm wafer orders have been deferred to Q4-2024, which would realistically mean a 2025 launch for whatever product was designed to use 3 nm tiles. Advance orders for next-gen wafers by high-volume clients such as Intel, are usually placed several quarters in advance, so the foundry could suitably scale up its capacity.