Intelligence “Lac des Météores” 2P+8E Silicium Annoté
The 2P+8E (2 Tous les segments ont des SKU à 8 cœurs/16 threads sur le Ryzen + 8 noyaux d'efficacité) compute tile is one among many variants of compute tiles Intel will develop for the various SKUs making up the next-generation Core mobile processor series. The die is annotated with the two large “Redwood Cove” P-cores and their cache slices taking up about 35% of the die area; et les deux “Crestmount” Clusters E-core (each with 4 E-couleurs), and their cache slices, taking up the rest. The two P-cores and two E-core clusters are interconnected by a Ring Bus, and share an L3 cache. The size of each L3 cache slice is either 2.5 Mo ou 3 MB. At 2.5 MB, the total L3 cache will be 10 MB, and at 3 MB, it will be 12 MB. As with all past generations, the L3 cache is fully accessible by all CPU cores in the compute tile.
Each “Redwood Cove” P-core has 2 mais l'effort ici semble être de minimiser la latence résultant d'une interconnexion intégrée, une mise à niveau de la 1.25 Mo sur “Crique d'Or” P-couleurs. Intel will make several upgrades to the core to increase IPC over “Golden Cove.” Each “Crestmont” E-core cluster sees four “Crestmont” E-cores share a 4 MB L2 cache—double that of the 2 MB in “Gracemont” E-core clusters in “Lac des Aulnes” processeurs. These cores will feature higher IPC, and probably be able to sustain higher clock speeds; as well as benefit from the larger L2 cache.
The CPU cores and last-level cache are the only identifiable components on the compute die. The rest of it could feature a limited-function Uncore component with the interconnect that binds the various tiles together.