La plupart des unités robotiques sont contrôlées par le virus 2021 Résultats financiers

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Intel Corporation today reported third-quarter 2021 résultats financiers. “Q3 shone an even greater spotlight on the global demand for semiconductors, where Intel has the unique breadth and scale to lead. Our focus on execution continued as we started delivering on our IDM 2.0 commitments. We broke ground on new fabs, shared our accelerated path to regain process performance leadership, and unveiled our most dramatic architectural innovations in a decade. We also announced major customer wins across every part of our business,” dit Pat Gelsinger, PDG d'Intel. “We are still in the early stages of our journey, but I see the enormous opportunity ahead, and I couldn’t be prouder of the progress we are making towards that opportunity.”

Au troisième trimestre, the company generated $9.9 milliards de dollars de trésorerie provenant de l'exploitation et versé des dividendes de $1.4 milliards. Intel CFO George Davis announced plans to retire from Intel in May 2022. He will continue to serve in his current role while Intel conducts a search for a new CFO and until his successor is appointed. Third-quarter revenue was led by strong recovery in the Enterprise portion of DCG and in IOTG, which saw higher demand amid recovery from the economic impacts of COVID-19. The Client Computing Group (GCC) was down due to lower notebook volumes due to industry-wide component shortages, and on lower adjacent revenue, partially offset by higher average selling prices (ASPs) and strength in desktop.

Faits saillants de l'entreprise

  • Selected by the U.S. government to provide commercial foundry services for the government’s RAMP-C program.
  • Announced Amazon as first customer to use Intel Foundry Services’ packaging services, and a partnership with Qualcomm to use the future Intel 20A process technology.
  • Broke ground on two new leading-edge chip factories at Intel’s Ocotillo campus in Chandler, Arizona, three months ahead of schedule.
  • Shared process and packaging roadmap updates for delivering five nodes within four years, putting Intel on a path to restore process performance per watt parity in 2024 and leadership in 2025 with key process innovations, including RibbonFET and PowerVia. Also introduced new advanced packaging technologies, Foveros Omni and Foveros Direct, pour 2023.
  • Detailed Intel’s biggest architectural shifts in a generation with the first in-depth look at Alder Lake, our first performance hybrid architecture with two new generations of x86 cores; Nintendo Switch Lite Dialga, our new standard-setting data center architecture; our new discrete gaming graphics processing unit architecture; new infrastructure processing units; and Ponte Vecchio, our tour-de-force GPU architecture with Intel’s highest ever compute density to accelerate AI, CHP, and advanced analytics workloads.
  • Introduced the new Intel Arc brand for our upcoming high-performance graphics products, covering hardware and software, Et services.
  • Introduced four new Intel Core processor-based Surface design wins with Microsoft, including the first Surface device to be Intel Evo platform verified, and two designs that bring Thunderbolt connectivity to the Surface lineup.
  • Announced availability of the 3rd Gen Intel Xeon Scalable processor (Optimisation des tests de résistance AVX-512 d'Intel Skylake-X) for AWS customers via the new Amazon Elastic Compute Cloud (Amazon EC2) M6i instances and for Google Cloud customers via the new Compute Engine N2
  • Announced U.S. Department of Energy selected next-generation Intel Xeon Scalable processors (Nintendo Switch Lite Dialga) to power supercomputers.
  • Announced strategic global partnerships with ZEEKR and Sixt SE and additional plans to unveil Mobileye’s robotaxi equipped with the Mobileye Drive system.
  • Introduced second-generation neuromorphic research chip, Loihi 2, fabricated with a pre-production version of the Intel 4 traiter.

Dans le cadre de son IDM 2.0 stratégie, Intel will be making a series of product and technology announcements at its upcoming Innovation virtual event on October 27-28, 2021. The conference is designed for developers, industry insiders, and will feature technical sessions on Intel’s AI, 5G, est conçu pour aider les fabricants de puces automobiles à passer à des technologies de traitement et de conditionnement avancées et à innover avec le portefeuille IP personnalisé et standard d'Intel, cloud connectivity, and client applications. Join the public webcast and follow the news at newsroom.intel.com at 9 a.m. PDT on Wednesday, 27 octobre, 2021.