Intel Details Ponte Vecchio Accelerator: 63 Tiles, 600 Watt TDP, and Lots of Bandwidth
[ad_1]
What is interesting is that Intel gave away details of the RAMBO cache. This novel SRAM technology uses four banks of 3.75 MB groups total of 15 MB per tile. They are connected to the fabric at 1.3 TB/s connection per chip. In contrast, compute tiles are connected at 2.6 TB/s speeds to the chip fabric. With eight RAMBO cache tiles, we get an additional 120 MB SRAM present. The base tile is a 646 mm² die manufactured in Intel 7 semiconductor process and contains 17 layers. It includes a memory controller, the Fully Integrated Voltage Regulators (FIVR), power management, 16-lane PCIe 5.0 connection, and CXL interface. The entire area of Ponte Vecchio is rather impressive, as 47 active tiles take up 2,330 mm², whereas when we include thermal dies, the total area jumps to 3,100 mm². And, of course, the entire package is much larger at 4,844 mm², connected to the system with 4,468 pins.
Intel chose TSMC’s N5 node for compute tiles, while the Xe-Link tiles use the TSMC N7 node. For RAMBO cache and Foveros base tiles, Intel 7 process is used. The entire chip is designed for maximum efficiency and performance and has a TDP of 450 Watts for air cooling, while the water cooling enables it to boost TDP to 600 Watts. Ponte Vecchio is designed for 63-81°C operation—a standard requirement for this type of product used in HPC sector.
[ad_2]