Intel Puts Ohio Fab Groundbreaking Ceremony on Hold, Indefinitely

The US Congress hasn’t been able to agree on passing what is known as the CHIPS Act, which consists of some US$52 billion in subsidies for semiconductor manufacturers and it appears that Intel isn’t very pleased. As such, the company is said to have put the brakes on the groundbreaking ceremony for its planned Ohio fab, which was meant to take place on the 22nd of July. Intel allegedly sent out an email to various state and federal lawmakers that it has placed the ceremony on hold, indefinitely due to the lack of progress on the CHIPS Act. In an official response from Intel to the Register, the company said that the event hasn’t been rescheduled, which the publications says means that there’s no new date planned for the groundbreaking ceremony.

It will apparently still be held at some point, but the Intel spokesperson had no answer when questioned if the ceremony was contingent on the CHIPS Act. However, the Register was told that the planned construction start date remains unchanged, for now. That said, Intel also issued a statement saying “the scope and pace of our expansion in Ohio will depend heavily on funding from the CHIPS Act.”, which was also part of the initial press release back in January when the fab plans were announced. If the CHIPS Act doesn’t happen, Intel’s plan seems to be to focus on countries outside of the US where the company is getting subsidies, although the Ohio fab is still likely to be built, just at a slower pace. Intel’s CEO, Pat Gelsinger hasn’t been mincing his words either, having told Congress “We’ve already wasted several quarters since the Senate acted last year, and now it’s time for us to move forward rapidly,” back in March.