Intel Said to be Considering Italy for European Chip Packaging Plant

Although Intel has already announced that it won’t be making any decision with regards to its investments in Europe this year, new rumours courtesy of Reuters are now suggesting that Intel is eyeing Italy for an investment of €4 to €8 billion for a new, advanced semiconductor chip packaging plant. This largely leaves Germany and France as the options for Intel’s so called “megafab” that the company is planning to build in Europe over the next few years.

Intel has already said it would invest around US$7 billion for a similar chip packaging plan in Penang, Malaysia, a location where Intel already has a chip packaging facility. When contacted by Reuters, Intel said “We are encouraged by the many possibilities to support the EU’s digital agenda and 2030 semiconductor ambitions. While current negotiations are ongoing and confidential, we plan to make an announcement as soon as possible.” The Italian government is also said to have some concerns with regards to how many jobs the plant will actually create, as well as what the energy costs will be, which could throw a spanner in the works if Intel doesn’t provide the right answers.