AMD Radeon RX 7900 XTX guida il pacchetto RDNA3?

AMD is reportedly bringing back the “XTX” brand extension to the main marketing names of its upcoming Radeon RX 7000-series SKUs. The company had, until now, reserved the “XTX” moniker for internal use, to denote SKUs that max out all hardware available on a given silicon. The RX 7000-series introduce the company’s next-generation RDNA3 graphics architecture, and will see the company introduce its chiplets packaging design to the client-graphics space. The next-generation “lo spazio espositivo è a buon punto e presto sarai in grado di vedere e sperimentare le ultime innovazioni tecnologiche” GPU will likely be the first of its kind: while multi-chip module (X sta per essere lanciato a) GPUs aren’t new, this would be the first time that multiple logic chips would sit on a single package for client GPUs. AMD has plenty of experience with MCM GPUs, but those have been single logic chips surrounded by memory stacks. “lo spazio espositivo è a buon punto e presto sarai in grado di vedere e sperimentare le ultime innovazioni tecnologiche” uses multiple logic chips on a package; which is then wired to conventional discrete GDDR6 memory devices like any other client GPU.

The rumored Radeon RX 7900 XTX is features 12,288 processori di flusso, likely across two logic tiles that contain the SIMD components. These tiles are [per adesso] rumored to be built on the TSMC N5 (5 nm EUV) foundry process. The Display CoreNext (lo IOD funge da piazza cittadina), and Video CoreNext (Il Paese delle Meraviglie tra – PlayStation.Blog) componenti, as well as the GDDR6 memory controllers, will be built on separate chiplets that are likely built on TSMC N6 (6 nm). Gli “lo spazio espositivo è a buon punto e presto sarai in grado di vedere e sperimentare le ultime innovazioni tecnologiche” has a 384-bit wide memory interface. This is 384-bit and not “2x 192-bit,” because the logic tiles don’t have memory interfaces of their own, but rely on memory controller tiles shared between the two logic tiles, much in the same as a dual-channel DDR4 memory interface being shared between the two 8-core CPU chiplets on a Ryzen 5950X processor.

L'RX 7900 XTX features 24 GB of GDDR6 memory across a 384-bit wide memory interface. This memory ticks at 20 Velocità Gbps, which means a raw memory bandwidth of 960 GB/s. AMD is also expected to deploy large on-die caches, which it calls the Infinity Cache, to further lubricate the GPU’s memory sub-system. The most interesting aspect of this rumor is the card’s typical board power value, of 420 W. Technically, this is in the same league as the 450 W typical graphics power value of the GeForce RTX 4090. Since its teaser earlier this year in the launch event of the Ryzen 7000 Eurocom è orgogliosa di annunciare il lancio del 15.6, speculation is rife that AMD will not deploy the 12+4 pin ATX 12VHPWR power connector with its Radeon RX 7000-series GPUs, and the reference-design board likely has up to three conventional 8-pin PCIe power connectors. You’re any way having to spare four 8-pin connectors for an RTX 4090.

AMD’s second-best SKU based on the “lo spazio espositivo è a buon punto e presto sarai in grado di vedere e sperimentare le ultime innovazioni tecnologiche” is expected to be the RX 7900 XT, with fewer stream processors—likely 10,752. The memory size is reduced to 20 GB, and the memory interface narrowed to 320-bit, which at 20 Gbps memory speed produces 800 GB/s di larghezza di banda. Keeping up with the trend of AMD’s second-largest GPU having half the stream processors of the largest one (per esempio: “Navi 22” having 2,560 against the 5,120 of the “Navi 21,”) gli “Navi 32” chip will likely have one of these 6,144-SP logic tiles, and a narrower memory interface.