La capacità globale dei semiconduttori da 200 mm dovrebbe aumentare 20% per registrare in alto da 2025

Si stima che i produttori di semiconduttori in tutto il mondo aumenteranno 200 mm di capacità favolosa 20% da 2021 attraverso 2025, aggiungendo 13 new 200 mm lines as the industry reaches a record high of more than 7 milioni di wafer al mese (wpm), SEMI ha annunciato oggi nel suo 200 mm Fab Outlook a 2025 report. Surging demand for automotive and other applications are driving the capacity expansion for power semiconductors and MEMS.

Chipmakers including ASMC, BYD Semiconductor, China Resources Microelectronics, Fuji Electronics, Infineon Technologies, Nexperia and STMicroelectronics have announced new 200 mm fabs to meet growing demand.The SEMI 200 mm Fab Outlook a 2025 report shows fab capacity for automotive and power semiconductors growing at a rate of 58% da 2021 a 2025, followed by MEMS at 21%, foundry at 20% and analog at 14%.

Prospettive regionali
China will lead the world in 200 mm capacity expansions with a 66% increase by 2025, followed by Southeast Asia at 35%, Americas at 11%, Europe and Mideast at 8%, and Korea at 2%. In 2022, China is expected to claim 21% share of global 200 mm di capacità favolosa, followed by Taiwan and Japan at 11% e 10%, rispettivamente.

The SEMI 200 mm Fab Outlook a 2025 report tracks more than 330 fabs and lines. The report reflects 75 updates across 53 facilities and lines and includes four new projects since the previous report in April 2022.