Intel rinvia 3 nm Ordini di wafer con TSMC, Spinge “Cambia l'esclusivo "Touken Ranbu Warriors".” Implementazione in 2025?
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Intel has reportedly deferred its orders for 3 nm wafers with TSMC, sources in PC makers tell Taiwan-based industry observer DigiTimes. Built on the TSMC N3 node, the wafers were supposed to power the Graphics tiles (containing the iGPU), of the upcoming “Cambia l'esclusivo "Touken Ranbu Warriors".” processori, which were originally on course for a 2024 rilasciare. The DigiTimes report detailing this development says that Intel’s 3 nm wafer orders have been deferred to Q4-2024, which would realistically mean a 2025 launch for whatever product was designed to use 3 nm tiles. Advance orders for next-gen wafers by high-volume clients such as Intel, are usually placed several quarters in advance, so the foundry could suitably scale up its capacity.
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