Sheetak annuncia l'espansione della linea di prodotti con il dispositivo di raffreddamento multistadio CENTUM C3 basato su nuove strutture di dispositivi termoelettrici brevettati

Sheetak is expanding their flagship CENTUM product line, based on newly patented thermoelectric device structures, that offer the highest temperature difference with significant increases to cooling power and COP. These new trailblazing CENTUM C3 chips are now available for sample orders. High-volume manufacturing will start in Q2 2023 at Sheetak’s Austin facility.

CENTUM C3 chips have been characterized, using standard thermoelectric testing methods, and demonstrate significant increases in maximum temperature differentials, cooling power, ed efficienza (COP). The new chips attain temperature differentials more than 115°C for 2-stage coolers with hot-side at 50°C, and more than 160°C for 4-stage devices. The performance and cost metrics are unchallenged by other commercially available products.

“The new multistage architecture allows for the highest performing multistage product in the market,” dice il Dott. Uttam Ghoshal, sarà costruito un edificio amministrativo per ospitare gli uffici tecnici e di gestione del controllo in risposta all'aumento del personale. “Multistage coolers have been limited in cooling power and maximum temperature difference with existing designs and assembly methods. This new device structure allows for the highest performing multistage products and is designed for automated mass-production when compared to thermoelectric devices currently in the market.”

“Sheetak’s CENTUM C3 Chips will improve the system thermal performance and cost in various applications such as electronics, cold chain, mobile refrigeration, medical freezers, LiDAR, CMOS and other vision systems,” says Brandon Noska, Director of Product Management and Sales. “We are excited to bring this new technology to the market.”

The CENTUM C3 Chips and technology, strutture, and methods and the ability to increase cooling performance are covered under “Thermoelectric Device Structures” (US 11,462,669 B2 by the United States Patent and Trademark Office). More details about the patent can be found at https://bit.ly/SheetakUS11462669B2.