SK hynix per mostrare l'efficienza energetica, Prodotti di memoria ad alte prestazioni al CES 2023

SK hynix Inc. announced today that it will showcase a number of its core and brand-new products at the CES 2023, the most influential tech event in the world taking place in Las Vegas from Jan. 5th through Jan. 8°. The products, introduced under the theme of the “Green Digital Solution,” as part of the SK Group’s “Carbon-Free Future” campagna, are expected to attract Big Tech customers and experts given the significant improvement in performance and energy efficiency compared with the previous generation as well as the effect of lessening the impact on the environment.

Attention on energy-efficient memory chips has been on the rise as global tech companies pursue products that process data faster, while consuming less energy. SK hynix is confident that its products to be displayed at the CES 2023 will meet customers’ such needs with outstanding performance per watt and performance. The core product put forward at the show is PS1010 E3.S, an eSSD product composed of multiple 176-layer 4D NAND that supports the fifth generation of the PCIe interface.

SK hynix said that the introduction of the PS1010, a combination of the company’s industry-leading technologies, was made timely as the server chip market continues to grow despite the current industry downturn.

The PS1010 product shows improvement both in reading and writing speed by 130% e 49%, rispettivamente, compared with the previous generation. Its performance-per-watt is also improved by more than 75%, helping customers reduce costs to run servers and carbon emission.

“We’re proud to launch PS1010, an ultrahigh-performance product with self-developed controller and firmware, at the CES 2023, la più grande fiera tecnologica del mondo,” Yun Jae Yeon, Responsabile della pianificazione del prodotto NAND, disse. “Questo prodotto risolverà il punto dolente dei nostri clienti con chip server, spianando la strada per una maggiore competitività nel business NAND per noi.”

Altri prodotti da presentare alla fiera sono HBM3, un prodotto di memoria con le migliori specifiche al mondo per il calcolo ad alte prestazioni, GDDR6-AiM che adotta la tecnologia PIM e la memoria CXL in grado di espandere in modo flessibile la capacità e le prestazioni della memoria.

SK hynix presenterà anche la tecnologia di raffreddamento ad immersione di SK enmove, specializzata in efficienza energetica. La tecnologia, progettato per aiutare a raffreddare il calore dei server generato durante il funzionamento, marks a successful case where SK hynix cooperated with other SK companies or external business partners to create new values in the semiconductor business.