Micron Delivers Vertically-Integrated 176-Layer NAND Data Center SSD
This new data center SSD includes Micron’s industry-leading NAND, which contains 176 layers of storage cells and proven CMOS-under-the-array technology, to deliver an ultraefficient design. Integrated with Micron’s own DRAM, internally developed SoC and associated firmware, this vertically integrated SSD enables the company to rapidly respond to customer needs in the market and support strengthened device security.
Significantly Reduced Latency
The 7450 SSD achieves latency at or below 2 ms for 99.9999% QoS in common, mixed, random workloads— driving up performance in databases such as Microsoft SQL Server, Oracle, MySQL, RocksDB, Cassandra and Aerospike, among others. Compared to SATA SSDs, latency is reduced by nearly 50%, and read bandwidth is improved by up to 12 times.
Diverse Mix of Capacities and Form Factors
The 7450 SSD features multiple capacity options to fit myriad data center needs. Its wide capacity range — from 400 GB to 15.36 TB — includes an industry-leading capacity of 8 TB in a compact E1.S form factor. In addition, the industry’s broadest set of form factors for data center SSDs addresses the unique challenges of data center workloads.
- U.3, M.2 and E1.S form factor options meet evolving space, power and thermal needs.
- The industry’s only PCIe Gen4 U.3 SSD, in both 15 mm and 7 mm thicknesses, provides flexibility for platforms that require 2.5-inch NVMe drives.
- The PCIe Gen4 M.2 22×80 mm SSD, designed primarily for server boot use, is a compact form factor supporting power loss protection.